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Selective Soldering

Quadron (PLC)

High specification, bench top rotary table soldering machine

A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PLC-controlled movement technology.

Much of its versatility is owed to the specially designed programming system which allows the user access to all fluxing and soldering parameters at any time. In addition, rapid product changeover is achieved quickly and easily through simple tooling design and program identification.

The machine is at home processing both coils/sub-assemblies/transformers or small PCBs, in either small or large batches. Cycle times as low as 5 seconds can be achieved.

Description

Fluxing System

The flux is applied to the terminals via a crucible or sprung test probes, which is lifted from the bath to the component, this provides high quality and consistent repeatability. Flux application is of paramount importance, this is where the Quadron has an advantage, as it can control the application and avoid bobbin contamination by applying flux accurately. Excess flux and insulation residue is kept to a minimum by careful control of the dip height and immersion time, this being achieved through stepper drive motors. The Quadron can be supplied with either a fixed flux bath or self-contained recycling flux tank which helps reduce the evaporation of the flux thinners.

Soldering

The Quadron uses a well proven solder pump system and incorporates a solder nozzle which can be of various designs to suit the product. Dross is removed from the nozzle prior to the next soldering operation by increasing the pump speed and bursting solder from the nozzle, this occurs during the index operation and does not impede the overall cycle time. The component is dipped in the solder by means of the precision stepper driven tooling slide, which provides precise, accurate and repeatable results. Also, for the optimum soldered joint, Pillarhouse is able to provide a Nitrogen shroud which makes the soldering operation totally inert and helps prevent bridging, reduces dross, and provides an improved quality. One major advantage the Quadron has is the ability to tilt a component out of the solder, this facility will help to prevent solder bridging of fine pitched connectors and the like.

Programming

The Quadron can be quickly and easily programmed to solder a wide range of different products, e.g., coils, transformers, wire terminations and small PCB’s. The fluxing and soldering parameters are entered via a 7″ LCD display and a keyboard, to give full control of: solder bath temperature, flux, and solder dip heights (increments of 0.1mm), and flux and solder immersion time (to within 0.1 of a second). Additional operations can also be controlled, e.g., component test facility, component unload and adjustment of the cycle time etc. A 7-day wake-up timer is included as standard equipment which enables the machine to be automatically powered-on and bought up to temperature prior to the start of a working shift.

System Options

Turnover

The optional turnover facility enables components with terminals on numerous sides to be handled on the same tooling, with fluxing and soldering performed at the same time without the need for the component to be re-loaded. Also, if a component has different soldering requirements on each side, the Quadron will identify different programming parameters for each.

Automatic Test/Unload

An interface is provided, as standard, to allow the integration of continuity testers and/or unload facilities, offering components the ability to be tested for electrical continuity or resistance prior to the component being automatically or manually ejected as a pass or fail.

Solder Top-up

This optional solder top-up ensures the solder level in the bath is kept constant; the level is automatically continually monitored using a temperature differential system which instructs the system to automatically top-up the solder. The wire feeder uses a reel of 3mm diameter solder which is mounted on the rear of the machine; the solder is fed into the bath pneumatically.

Specifications

Height: 1484mm / 58”
Width: 630mm / 25”
Depth: 764mm / 30”
Solder: All commonly used solder types – including lead-free
Applicators: Special dedicated nozzles
Air supply pressure: 5 bar / 72 psi
Nitrogen supply pressure: 5 bar / 72 psi
Nitrogen purity: 99.995% or better
Power supplies: Single phase + PE
Voltage: 208V – 250V
Frequency: 50/60Hz

NITROGEN GENERATION ‘PillarGEN 30/40/80’

Cost effective Nitrogen generating systems

The PillarGEN Nitrogen generation system has been specifically designed to meet the Nitrogen supply requirements of the current range of Pillarhouse selective soldering systems.
The latest Nitrogen generation design technology combines compact size with ultra-quiet operation.

Description

The PillarGEN 30 is specifically designed to integrate with the Pillarhouse Pilot bench top soldering system.

The PillarGEN 40 and 80 systems offer a fully integrated communication protocol to allow the monitoring and displaying of the unit’s status on the selective soldering machine. These values include oxygen concentration, flow rates and pressure – incoming air/outgoing Nitrogen.

Specifications

PillarGEN-30

Height: 835mm / 33”
Width: 915mm / 36“
Depth: 700mm / 28”
Air requirement: 400 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
Power supplies: Single phase + PE
Voltage: 100V – 240V
Output: 30 litres Nitrogen/min. @ 100 ppm average 99.990%
Operating noise level: 70 dB or less

PillarGEN-40

Height: 1155mm / 46”
Width: 968mm / 38“
Depth: 700mm / 28”
Air requirement: 500 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
Power supplies: Single phase + PE
Voltage: 100V – 240V
Output: 40 litres Nitrogen/min. @ 50 ppm average 99.995%
Operating noise level: 70 dB or less

PillarGEN-80

Height: 1155mm / 46”
Width: 1020mm / 40“
Depth: 970mm / 38”
Air requirement: 1000 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
Power supplies: Single phase + PE
Voltage: 100V – 240V
Output: 80 litres Nitrogen/min. @ 50 ppm average 99.995%
Operating noise level: 70 dB or less

Orissa Synchrodex Combo

In-line or stand-alone fluxer / pre-heater

This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single soldering unit with on-board fluxing and pre-heat functions. It also provides a reduced footprint and cost savings over the conventional three module, fluxing, pre-heat, and selective soldering work cell.

Description

The fluxer/pre-heat combo operates in tandem with the selective soldering unit and can be configured with either Drop-Jet or ultrasonic flux heads and both top and bottom side IR pre-heat functions. Twin pitch flux heads are available for further cycle time reductions.

The machine utilises an XY positioning system to position the flux head as required. A Drop-Jet flux head is supplied as standard with an ultrasonic head being ordered as an alternative or in addition to the standard head. Both systems provide precise control of the flux being deposited on the board.

Programming and control of the machine is via a PC using the Windows^® based PillarCOMMX software. Programs and machine configuration are protected by a customer selectable, multilevel password security system.

The machine is freely programmable to cater to different board layouts. Each flux joint is separately programmable to its own set of required parameters. The programming system employs a component data library enabling quantities of similar joints to use the same fluxing data outline. Visually assisted self-teach alignment allows for fast and accurate board programming.

Standard Features

In-line motor driven auto width adjust – through feed synchronous movement conveyor
Conveyor side clamping
Integral PC and machine mounted TFT monitor
Titanium Drop-jet fluxer
Internal fume extraction
Colour programming camera
PillarCOMMX Windows^® based ‘Point & Click’ interface
Light stack
Flux level sensor
Multiple level password protection
SMEMA compatible
Multiple level password protection
Day-to-day service kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray and/or flow

System Options

Ultrasonic fluxing
Dual drop-jet / ultrasonic fluxing
Top side instant IR pre-heat
Closed-loop pyrometer temperature control
Encoders on X, Y and Z axis

Specifications

Height: 1615mm / 63” – excluding light stack
Width: 813mm / 32“
Depth: 2024mm / 80”
Board size: Max. – 457mm x 610mm / 18”x 24”
Min. – 102mm x 102mm / 4”x 4”
Edge clearance: Above/below 3mm
Height clearance: Below 40mm – above 45mm
100mm – upon request
Extraction: Fan: 276mm dia.
Rating: 1000m3/hr / 589 CFM
Flux: Low maintenance Drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water-soluble system available.
Flux tank capacity: 1 litre
Fluxer speed: 50 dots/second
Deposition size: 4.0-6.0mm / 0.16-0.24”
X, Y & Z axis resolution: 0.15mm
Repeatability: +/- 0.05mm.
Nitrogen supply pressure: 5 bar / 72 psi
Nitrogen usage: 10-30 litres/min.
Air Supply Pressure: 5 bar / 72 psi
Air Usage: 10 litres/min. / 0.35CFM
Power Supplies: 1 phase + PE.
Voltage: 230V
Frequency: 50/60 Hz.
Power: 13kVA max. – machine configuration dependent
Transport: Conveyor
Programming: PillarCOMMX Windows^® based ‘Point & Click’ interface

Orissa Synchrodex

Flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.

Description

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side pre-heat function. Pre-heat can be controlled via an optional top side closed-loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology - single point AP nozzle design - incorporating patented spiral solder return to bath technology, offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micronozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and assists in the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Synchrodex is controlled by a PC, through PillarCOMMX, a Windows^® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

In-line motor driven auto width adjust through feed synchronous movement conveyor
Conveyor side clamping
Integral PC and machine mounted TFT monitor
Auto solder wire feed & level detect
Heated inerted Nitrogen system
Drop-Jet fluxer
Set of AP solder nozzle tips
Internal fume extraction
Solder wave height measurement and correction
Colour programming camera
Light stack tower
Windows^® based PillarCOMMX ‘Point & Click’ interface
Auto-nozzle conditioning system
Thermal nozzle calibration system using integrated setting camera
Windows^® based PillarCOMMX ‘Point & Click’ interface
PillarPAD offline programming system
Auto fiducial recognition and correction system
Flux level sensor
Multiple level password protection
SMEMA compatible
Process viewing camera with record feature
Lead-free capability
Day-to-day service kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow, and spray & flow
Pump RPM
O₂ ppm
Nitrogen flow

System Options

Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top side instant IR pre-heat
Closed-loop pyrometer temperature control
Bottom-side hot Nitrogen selective pre-heat
Laser PCB warp correction
Solder reel identification
Solder bath coding – identifies correct bath for program
Encoders on X, Y and Z axis
Nitrogen generator

Specifications

Height: 1615mm / 63” – excluding light stack
Width: 813mm / 32“
Depth: 2024mm / 80”
Board size: Max. – 457mm x 610mm / 18”x 24”
Min. – 102mm x 102mm / 4”x 4”
Edge clearance: Above/below 3mm
Height clearance: Below 40mm – above 45mm
100mm – upon request
Extraction: Fan: 276mm dia.
Rating: 1000m3/hr / 589 CFM
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 15kg standard – 25kg large bath
Applicators: AP style – 2.5 – 16mm dia.
Extended and Jet-Tip nozzles – up to 25mm dia.
Jet-Wave nozzles – up to 25mm width
150mm Wave nozzle
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
Flux tank capacity: 1 litre
Fluxer speed: 50 dots/second
Deposition size: 4.0-6.0mm / 0.16-0.24”
X, Y & Z axis resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen supply pressure: 5 bar / 72 psi
Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Air usage: 10 litres/min. / 0.35 CFM
Power Supplies: Single phase + PE
Voltage: 230V
Frequency: 50/60Hz
Power: 10.5kVA max. – machine configuration dependent
Transport: Conveyor
Programming: PillarCOMMX Windows^® based ‘Point & Click’ interface

Orissa Synchrodex Pro

Enhanced, flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.

Description

Our Synchrodex Pro is a modular system with a range of in-line equipment offering the ultimate in flexibility, with the ability to upgrade to high-speed throughput when multiple modules are placed together.

The standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers optional top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput.

Our 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management.

Our largest PCB handling capability of 1143mm x 610mm can be achieved when using the XL frame size.

The Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm micronozzle, Jet-Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

The Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET, a Windows^® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

In-Line Disk Drive Auto Width Adjust Throughfeed Synchronous
Movement Conveyor
Conveyor Side Clamping
Integral PC and Machine Mounted TFT Monitor
Auto Motorised Solder Wire Feed & Level Detect
Drop-Jet fluxer
Heated Inerted Nitrogen System
Internal Fume Extraction
Colour Programming Camera
610mm x 610mm (24" x 24") Board Handling Size in a 1060mm Frame
PillarCOMM.NET Windows® based Software
Offline Programming Software
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
Solder Pot Coding
Auto Fiducial Recognition & Correction System
Solder Wave Height Measurement
Mechanical Impellor Style Pump Assembly
Pump RPM Monitoring
Nitrogen Analyser
Auto Nozzle Conditioning System
Process Viewing Camera
Multilevel Password Security System
Light Stack Tower
Flux Level Sensor
Lead-Free Capability
Set of Standard AP Style Solder Nozzle Tips - 2.5, 3, 3.5, 4, 5, 6, 8, 10, 12mm
Accessory Kit

Monitoring Options

Flux flow monitoring
Nitrogen purity monitoring
Nitrogen mass flow meter
Nozzle nitrogen purity monitoring

System Options

High-definition process viewing camera
Top side IR pre-heat, with closed-loop control
Motorised underside IR pre-heat, at all cell positions
Ultrasonic fluxing
Additional dual Drop-Jet / Ultrasonic fluxing
Laser-based PCB warp correction
1.5, 2, 2.5mm micronozzle(s)
Solder reel identification
Nitrogen generator

Specifications

Height: 1391mm / 55” – excluding light stack and monitor
Width: 1060mm / 42” or 1600mm / 63” (depending on frame size)
Depth: 2250mm / 88”
Board size: Min. – 102mm x 102mm / 4”x 4” Max. (standard variants) – 420mm x 610mm / 16.5” x 24” and 610mm x 610mm / 24” x 24” (optional sizes) – 1143mm x 610mm / 45” x 24”
Edge clearance: Above/below 3mm
Height clearance: Above 45mm / below 40mm nominal
Extraction: Fan: 236mm dia.
Rating: 940m³/hr/553CFM
Solder: Most commonly used solder types - includes lead-free
Solder pot capacity: 11kg/24lb (standard) - 20kg/44lb (large)
Nozzles/Applicators: Micronozzle - 1.5mm to 2.5mm AP style - 2.5mm to 16mm dia. Extended AP style - 2.5mm to 16mm dia. Jet-Tip style - 6mm to 25mm dia. Jet-Wave nozzle - up to 40mm width 75mm and 150mm Wave nozzle Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional ultrasonic system available
X, Y & Z axes resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen supply pressure: 5 bar/72 psi
Nitrogen usage: 30-100 litres/min./1.06-3.53 CFM- solder nozzle configuration dependent
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar/72 psi
Air usage: 10 litres/min./0.35 CFM
Power supplies: Three-phase + neutral + PE
Voltage: 230 V phase to neutral/400V phase to phase
Frequency: 50/60Hz
Power: Machine configuration dependent
Transport: Conveyor (IPC-SMEMA-9851 compliant)
Programming: PillarCOMM.NET software - Windows® based ‘Point & Click’ interface

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